On June 6, the Shenzhen Development and Reform Commission issued the "Shenzhen Action Plan for Cultivating and Developing Semiconductor and Integrated Circuit Industry Clusters (2022-2025)", proposing to expand the enrollment scale of semiconductor majors and focus on cultivating a group of high-level and compound talents ; Focus on breaking through the design of high-end general-purpose chips such as CPU, GPU, DSP, and FPGA, and lay out the development of special-purpose chips such as artificial intelligence chips and edge computing chips; strengthen support for design companies. By 2025, the revenue of the integrated circuit industry will exceed 250 billion yuan, and more than 4 professional integrated circuit industrial parks are planned to be built.
The semiconductor and integrated circuit industry mainly includes chip design, manufacturing, packaging and testing, as well as related raw materials, production equipment and components. Shenzhen is one of the distribution centers, application centers and design centers of semiconductor and integrated circuit products in my country. In recent years, the industry has maintained a rapid development trend. In 2021, the main business income of Shenzhen's integrated circuit industry will exceed 110 billion yuan, and it has a national-level integrated circuit design. Industrialization Base, National Third Generation Semiconductor Technology Innovation Center, National Demonstration Microelectronics Institute and other major innovation platforms.
Shenzhen has upstream and downstream resource advantages, outstanding upstream design capabilities, and a wide range of downstream application scenarios; Shenzhen has a high degree of market-oriented allocation of innovation elements, and a flexible mechanism for selecting and employing personnel, which facilitates the gathering of high-end talents and is conducive to accelerating technological innovation and achievement transformation. However, the scale of the integrated circuit manufacturing industry needs to be improved and cannot meet the needs of industrial development; industrial software, production equipment and key materials are highly dependent on foreigners; the layout of major functional platforms needs to be strengthened, and industrial common problems need to be solved quickly; professionally planned integrated circuit industry The park is not enough.
To this end, the "Action Plan" proposes that by 2025, the industry revenue will exceed 250 billion yuan, form more than 3 design companies with revenue exceeding 10 billion yuan and a group of design companies with revenue exceeding 1 billion yuan, and introduce and cultivate 3 revenue. Manufacturing enterprises with a value of more than 2 billion yuan have significantly improved the energy level of the integrated circuit industry, and the industrial structure has become more reasonable.
By 2025, the R&D investment intensity of key enterprises in the design industry will exceed 10%, the density and quality of invention patents will be significantly improved, the market share of domestic EDA software will be further increased, a batch of key technology transformation and batch application will be realized, and a complete talent introduction and training will be formed. system, and built more than 5 public technical service platforms.
A large-scale production line has been built, and upstream and downstream links such as equipment, materials, advanced packaging and testing have been completed, and a complete wide-bandgap semiconductor industry chain has been formed from substrate, epitaxy, chip manufacturing to device application. By 2025, the level of localization of the industrial chain will be further improved, the supporting and collaborative capabilities of the local industrial chain will be significantly enhanced, and more than 4 professional integrated circuit industrial parks will be planned and constructed.
In terms of high-end chip breakthrough engineering, the focus is on the design of high-end general-purpose chips such as CPU, GPU, DSP, and FPGA, and the development of special-purpose chips such as artificial intelligence chips and edge computing chips. Taking the 5G communication industry as the traction, it will make a comprehensive breakthrough in core chips such as RF front-end chips, baseband chips, and optoelectronic chips. Focus on pan-IoT applications such as smart "terminals", and promote the rapid industrialization of ultra-low-power dedicated chips and NB-IoT chips. Focusing on emerging formats such as smart cars, actively cultivate the supply chain of upstream chips such as lidar. Strengthen the support for the design enterprise tape-out.
In terms of advanced manufacturing supplementary chain projects, strengthen cooperation with integrated circuit manufacturing enterprises, plan to build 28nm and above process wafer foundries, and plan to build high-end characteristic process production lines such as BCD and semiconductor lasers. Support the construction of high-end chip capacitors, inductors, resistors and other electronic components production lines. Support the settlement of major semiconductor and integrated circuit manufacturing projects representing new development directions, and guide state-owned industrial groups and social capital to make equity investments in projects. Encourage the transformation and upgrading of existing integrated circuit production lines.
In terms of advanced packaging and testing improvement projects, we will accelerate the upgrading of packaging and testing process technology and production capacity in accordance with market demand, and form packaging and testing capabilities that match design and manufacturing. Accelerate the research and development and industrialization of packaging technology for high-power MOSFET devices and high-density memory devices. Vigorously develop advanced packaging core technologies such as wafer-level and system-level, as well as advanced wafer-level testing technologies such as pulse sequence testing and IC integrated probe cards. Support independent testing and analysis service companies or institutions to become bigger and stronger, and form a complement to large packaging and testing companies.
In terms of compound semiconductor catch-up project, improve the R&D and production level of compound semiconductor materials and equipment such as gallium nitride and silicon carbide, and accelerate the development, transformation and first application of device manufacturing technology. Facing emerging application markets such as 5G communications, new energy vehicles, and smart terminals, we will vigorously introduce compound semiconductor companies with leading technologies. Guide enterprises to participate in the formulation of technical standards for key links, seize the commanding heights of the industry, and enhance product market dominance and voice. Accelerate the application of product verification, encourage enterprises to promote the trial of compound semiconductor products, and improve the competitiveness of system and complete machine products.
In terms of talent introduction and cultivation and cohesion project, strengthen the construction of educational research and development environment in existing colleges and universities, expand the enrollment scale of semiconductor majors, and focus on cultivating a group of high-level and compound talents.
The "Action Plan" proposes to form a spatial layout of silicon-based in the east, compound in the west, and design in the middle. The six districts of Nanshan, Futian, Baoan, Longhua, Longgang and Pingshan are the key development targets. Among them, Longgang has both R&D, design and manufacturing functions, Nanshan and Futian are R&D and design, and Baoan, Longhua and Pingshan are manufacturing.
Nanshan and Futian Districts are positioned as clusters of design companies, focusing on breakthroughs in high-end chip design and consolidating Shenzhen's advantages in the field of integrated circuit design. Bao'an and Longhua districts are positioned as compound semiconductor clusters, creating a complete wide-bandgap semiconductor industry chain from materials to chip manufacturing to device applications. Longgang and Pingshan are positioned as silicon-based semiconductor gathering areas, focusing on the implementation of a series of major silicon-based integrated circuit projects, and laying out the industrial chain from front-end R&D to chip manufacturing.
The semiconductor and integrated circuit industry mainly includes chip design, manufacturing, packaging and testing, as well as related raw materials, production equipment and components. Shenzhen is one of the distribution centers, application centers and design centers of semiconductor and integrated circuit products in my country. In recent years, the industry has maintained a rapid development trend. In 2021, the main business income of Shenzhen's integrated circuit industry will exceed 110 billion yuan, and it has a national-level integrated circuit design. Industrialization Base, National Third Generation Semiconductor Technology Innovation Center, National Demonstration Microelectronics Institute and other major innovation platforms.
Shenzhen has upstream and downstream resource advantages, outstanding upstream design capabilities, and a wide range of downstream application scenarios; Shenzhen has a high degree of market-oriented allocation of innovation elements, and a flexible mechanism for selecting and employing personnel, which facilitates the gathering of high-end talents and is conducive to accelerating technological innovation and achievement transformation. However, the scale of the integrated circuit manufacturing industry needs to be improved and cannot meet the needs of industrial development; industrial software, production equipment and key materials are highly dependent on foreigners; the layout of major functional platforms needs to be strengthened, and industrial common problems need to be solved quickly; professionally planned integrated circuit industry The park is not enough.
To this end, the "Action Plan" proposes that by 2025, the industry revenue will exceed 250 billion yuan, form more than 3 design companies with revenue exceeding 10 billion yuan and a group of design companies with revenue exceeding 1 billion yuan, and introduce and cultivate 3 revenue. Manufacturing enterprises with a value of more than 2 billion yuan have significantly improved the energy level of the integrated circuit industry, and the industrial structure has become more reasonable.
By 2025, the R&D investment intensity of key enterprises in the design industry will exceed 10%, the density and quality of invention patents will be significantly improved, the market share of domestic EDA software will be further increased, a batch of key technology transformation and batch application will be realized, and a complete talent introduction and training will be formed. system, and built more than 5 public technical service platforms.
A large-scale production line has been built, and upstream and downstream links such as equipment, materials, advanced packaging and testing have been completed, and a complete wide-bandgap semiconductor industry chain has been formed from substrate, epitaxy, chip manufacturing to device application. By 2025, the level of localization of the industrial chain will be further improved, the supporting and collaborative capabilities of the local industrial chain will be significantly enhanced, and more than 4 professional integrated circuit industrial parks will be planned and constructed.
In terms of high-end chip breakthrough engineering, the focus is on the design of high-end general-purpose chips such as CPU, GPU, DSP, and FPGA, and the development of special-purpose chips such as artificial intelligence chips and edge computing chips. Taking the 5G communication industry as the traction, it will make a comprehensive breakthrough in core chips such as RF front-end chips, baseband chips, and optoelectronic chips. Focus on pan-IoT applications such as smart "terminals", and promote the rapid industrialization of ultra-low-power dedicated chips and NB-IoT chips. Focusing on emerging formats such as smart cars, actively cultivate the supply chain of upstream chips such as lidar. Strengthen the support for the design enterprise tape-out.
In terms of advanced manufacturing supplementary chain projects, strengthen cooperation with integrated circuit manufacturing enterprises, plan to build 28nm and above process wafer foundries, and plan to build high-end characteristic process production lines such as BCD and semiconductor lasers. Support the construction of high-end chip capacitors, inductors, resistors and other electronic components production lines. Support the settlement of major semiconductor and integrated circuit manufacturing projects representing new development directions, and guide state-owned industrial groups and social capital to make equity investments in projects. Encourage the transformation and upgrading of existing integrated circuit production lines.
In terms of advanced packaging and testing improvement projects, we will accelerate the upgrading of packaging and testing process technology and production capacity in accordance with market demand, and form packaging and testing capabilities that match design and manufacturing. Accelerate the research and development and industrialization of packaging technology for high-power MOSFET devices and high-density memory devices. Vigorously develop advanced packaging core technologies such as wafer-level and system-level, as well as advanced wafer-level testing technologies such as pulse sequence testing and IC integrated probe cards. Support independent testing and analysis service companies or institutions to become bigger and stronger, and form a complement to large packaging and testing companies.
In terms of compound semiconductor catch-up project, improve the R&D and production level of compound semiconductor materials and equipment such as gallium nitride and silicon carbide, and accelerate the development, transformation and first application of device manufacturing technology. Facing emerging application markets such as 5G communications, new energy vehicles, and smart terminals, we will vigorously introduce compound semiconductor companies with leading technologies. Guide enterprises to participate in the formulation of technical standards for key links, seize the commanding heights of the industry, and enhance product market dominance and voice. Accelerate the application of product verification, encourage enterprises to promote the trial of compound semiconductor products, and improve the competitiveness of system and complete machine products.
In terms of talent introduction and cultivation and cohesion project, strengthen the construction of educational research and development environment in existing colleges and universities, expand the enrollment scale of semiconductor majors, and focus on cultivating a group of high-level and compound talents.
The "Action Plan" proposes to form a spatial layout of silicon-based in the east, compound in the west, and design in the middle. The six districts of Nanshan, Futian, Baoan, Longhua, Longgang and Pingshan are the key development targets. Among them, Longgang has both R&D, design and manufacturing functions, Nanshan and Futian are R&D and design, and Baoan, Longhua and Pingshan are manufacturing.
Nanshan and Futian Districts are positioned as clusters of design companies, focusing on breakthroughs in high-end chip design and consolidating Shenzhen's advantages in the field of integrated circuit design. Bao'an and Longhua districts are positioned as compound semiconductor clusters, creating a complete wide-bandgap semiconductor industry chain from materials to chip manufacturing to device applications. Longgang and Pingshan are positioned as silicon-based semiconductor gathering areas, focusing on the implementation of a series of major silicon-based integrated circuit projects, and laying out the industrial chain from front-end R&D to chip manufacturing.
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